WASHINGTON—A bipartisan bill to subsidize domestic semiconductor manufacturing cleared its first procedural hurdle Tuesday by a 64-34 vote, although the details of the legislation are still being worked out.
The legislation would provide roughly $52 billion in subsidies to encourage chip companies to ramp up U.S. production, which the White House and leaders of both parties see as a critical national security need. Lawmakers worked late Tuesday to agree on other elements of the competitiveness package, called USICA.
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